计算平台
- 处理器平台: Intel Xeon 6 6900 双路
- 整机形态: 10U

XSA2AH V4A B3-Y flagship AI server features an 8-GPU module (SXM5/OAM2.0) for superior thermal and maintenance performance. With dual Intel® Xeon® 6 Processors (6900 Series, BHS-AP), 24× 6400MT/s DDR5, 4× PCIe5.0 slots, and 20× drive bays, it boosts bandwidth by 50% and meets diverse computing needs. AI training, HPC, data center, etc. Position Application Features Excellent Performance Support up to 2 × Intel® Xeon® 6 Processors (6900 Series, BHS-AP) , up to 128 cores and TDP 500W each; Support up to 24 × DDR5 DIMM slots, up to 6400MT/s (RDIMM) and 8800MT/s (MRDIMM), up to 8 TB capacity. Flexible Configuration Up to 4 × PCIe5.0 expansion slots; Up to 20 × 2.5”HDDs (8 × SATA + 8 × NVMe in front, 4 × NVMe in rear); Optional 2 × M.2 2280 NVMe/SATA SSDs. Stable & Reliable The keyparts of the system are designed with redundancy, hot -swap and toolless installation; Integrated intelligent BMC management chip, support IPMI 2.0, Redfish, SNMP, etc; Support remote KVM, virtual media, state monitoring of key components, abnormal alarm, etc. BHS-AP 2S10U AI Server - 8 × B300XSA2AH V4A B3-Y
具体配置与交付周期请以最终确认的配置单为准。
实际配置以模型、数据量、并发量和部署环境为准。